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Solder

「 Nihon Handa solder products with 100 years of technology accumulation 」

Excellent printability with Nihon Handa's flux technology.
It has excellent slump prevention properties and heat resistance during pre-heating, and is well received for high-density work such as fine pitch printing including micro bumps.

■ DG-PREFORM SOLDER

Purpose of use	Die bonding for power devices, semiconductor ICs, and sealed packages
Shape	Disc, square pellet, tape, wire, washer, and ball
Features	Uses high-purity alloys with minimal impurities Removes dissolved gas, one of the causes of Pb solder void formation, through a vacuum degassing process called the "DG Method." Excellent wetting without contamination, oil, oxidation or surface scratches Soft and no solder Embossing tape package available for pellets Performance proven on in-vehicle and industrial equipment

■ Pb-Free Solder Product Guide

◎=Standard / ●=To be manufactured to order

■ General Solder Product Guide

Product number	Alloy composition(wt%)	Melting temperature(℃)		Remarks
Product number	Alloy composition(wt%)	Solidus	Liquidus	Remarks
05	Sn5 / Pb95	300	314	300°C High Temperature Solder
09	Sn1 / Ag1.5 / Pb97.5	309	309	300°C High Temperature Solder
07	Sn5 / Ag1.5 / Pb93.5	296	301	300°C High Temperature Solder
10	Sn10 / Pb90	268	301	270°C High Temperature Solder
27	Sn10 / Ag2 / Pb88	268	290	270°C High Temperature Solder
90	Sn90 / Pb10	183	212	Middle Temperature Solder
62	Sn62 / Ag2 / Pb36	179	190	Silver Contained Ternary Eutectic Solder
TA65	Sn65 / Sb0.5 / Ag0.4 / Pb34.1	180	186	No Tombstone, Creep Resistance
63	Sn63 / Pb37	183	185	Common Eutectic Solder
603	Sn60 / Bi3 / Pb37	172	182	No Tombstone, Heat Resistance

■ Comparison of Solder Paste Flux Characteristics

Serial No.	Model No.	Applied alloy	Features and application
Pb Free Flux	117(TF)	PF305. PF33. FNS	Halogen free type, High heat resistance, fine pitch response, flux transparent residue
	110(E)	PF305. 63. 62. TA65	General purpose transparent residue
	133	PF33. FNS	Non halogen type
	118	PF305. FNS	High heat resistance, ICT response, transparent residue, slump improvement
	LT1	141. 142	For Sn/Bi low-temperature solder

For more information, please visit the Nihon Handa website.

■ Low-Halogen with Good Wetting

■ Reduced Bridge Due to Good Wetting

■ Excellent Heating Slump Prevention Effect

■ Flux Transparent Residue