| 用途 | 电力设备、半导体IC及密封封装的芯片键合 |
| 形状 | 圆盘状和方形颗粒、胶带、金属丝、垫圈和球 |
| 特点 |
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| PAT | 品目编 | 合金结构(wt%) | 溶解温度(℃) | Product Type | |||||
| 固相线 | 液相线 | Bar | Wire | Cored | Preform | Paste | |||
| 1 | PF305 | Sn / Ag3.0 / Cu0.5 | 217 | 219 | ◎ | ◎ | ◎ | ◎ | ◎ |
| 1 | PF27 | Sn / Ag3.5 / Cu0.7 / α | 217 | 217 | ● | ● | |||
| 1 | PF270 | Sn / Ag3.5 / Cu0.7 | 217 | 217 | ● | ● | |||
| 1 | PF275 | Sn / Ag3.5 / Cu0.75 | 217 | 217 | ● | ● | ◎ | ||
| PF107 | Sn / Ag1.0 / Cu0.7 | 217 | 224 | ● | ● | ||||
| 4 | FNS | Sn / Ag3.5 / Cu0.5+Ni,Ge | 217 | 219 | ◎ | ● | ◎ | ◎ | ◎ |
| PF28 | Sn / Ag0.3 / Cu0.7 | 217 | 226 | ● | ● | ||||
| 1 | PF405 | Sn / Ag4.0 / Cu0.5 | 217 | 219 | ● | ● | |||
| 1 | PF217 | Sn / Ag4.7 / Cu1.7 | 217 | 219 | ● | ● | |||
| 03 | Sn / Ag3.5 | 221 | 221 | ◎ | ◎ | ◎ | ◎ | ◎ | |
| PF973 | Sn / Ag3.0 | 221 | 222 | ◎ | |||||
| PF04 | Sn / Cu0.7 | 227 | 228 | ◎ | ● | ● | |||
| 7 | PF9924 | Sn / Cu0.7 / Ni0.06 / P | 227 | 230 | ● | ||||
| 7 | PF9944 | Sn / Cu0.5 / Ni0.05 / P | 228 | 231 | ● | ||||
| --- | Sn / Sb10 | 246 | 248 | ● | ● | ||||
| 24 | Sn / Sb5 | 238 | 241 | ◎ | ◎ | ◎ | ◎ | ◎ | |
| 3 | Castin25 | Sn / Ag2.5 / Cu0.8 / Sb0.5 | 218 | 220 | ● | ● | |||
| 2 | PF33 | Sn / Ag3.2 / Bi2.8 / Cu0.7 / α | 206 | 213 | ● | ● | ◎ | ◎ | |
| 2 | PF34 | Sn / Ag2.5 / Cu0.5 / Bi1.0 | 213 | 218 | ● | ● | |||
| PF35 | Sn / Ag2.0 / Bi7.5 / Cu0.5 | 206 | 211 | ● | ● | ||||
| 5 | PF358 | Sn / Ag3.5 / Bi0.5 / In8.0 | 196 | 215 | ◎ | ● | |||
| 6 | PF353 | Sn / Ag3.5 / Bi0.5 / In3.0 | 206 | 217 | ● | ● | |||
| 14 | Sn / Bi58 | 139 | 139 | ● | ● | x | x | ● | |
| 8 | PF141 | Sn / Bi58 / Ag1.0 | 136 | 138 | ● | ● | x | x | ◎ |
| 8 | PF142 | Sn / Bi57 / Ag1.0 | 136 | 138 | ● | ● | x | x | ◎ |
| --- | Sn100 | 232 | 232 | ◎ | ◎ | ◎ | ● | ||
| 9 | PF1071 | Sn / Ag1.0 / Cu0.7 / Bi1.6 / In0.2 | 210 | 222 | ● | ||||
| 9 | PF1072 | Sn / Ag1.0 / Cu0.7 / Bi2.0 | 211 | 221 | ● | ||||
| --- | Sn / Ag25 / Sb10 | 228 | 395 | ● | |||||
| 品目编号 | 合金结构(wt%) | 溶解温度(℃) | 备注 | |
| 固相线 | 液相线 | |||
| 05 | Sn5 / Pb95 | 300 | 314 | 300°C High Temperature Solder |
| 09 | Sn1 / Ag1.5 / Pb97.5 | 309 | 309 | 300°C High Temperature Solder |
| 07 | Sn5 / Ag1.5 / Pb93.5 | 296 | 301 | 300°C High Temperature Solder |
| 10 | Sn10 / Pb90 | 268 | 301 | 270°C High Temperature Solder |
| 27 | Sn10 / Ag2 / Pb88 | 268 | 290 | 270°C High Temperature Solder |
| 90 | Sn90 / Pb10 | 183 | 212 | Middle Temperature Solder |
| 62 | Sn62 / Ag2 / Pb36 | 179 | 190 | Silver Contained Ternary Eutectic Solder |
| TA65 | Sn65 / Sb0.5 / Ag0.4 / Pb34.1 | 180 | 186 | No Tombstone, Creep Resistance |
| 63 | Sn63 / Pb37 | 183 | 185 | Common Eutectic Solder |
| 603 | Sn60 / Bi3 / Pb37 | 172 | 182 | No Tombstone, Heat Resistance |
| 系列No. | 型号No. | 应用合金 | 特点、应用 |
| Pb Free Flux | 117(TF) | PF305. PF33. FNS | Halogen free type，高耐热性，对应细间距，Flux残留透明 |
| 110(E) | PF305. 63. 62. TA65 | 通用、残留透明 | |
| 133 | PF33. FNS | Non halogen type | |
| 118 | PF305. FNS | 高耐热性，对应ICT，残留透明，改善坍塌 | |
| LT1 | 141. 142 | Sn/Bi系低温焊料用 |
CHN
Rapid Dry
Micro Dry
Profiler
SolMix
Check Right
加湿SYSTEM
Data logger
R.S Collector
P.L Cleaner
Solder
3D加工领域
其他辅料